NSN Part BUW12 With NSN 5961-01-300-7810 by Philips Circuit Assemblies - RFQ Form

Mfg Part Number: BUW12	NSN : 5961-01-300-7810	NIIN : 013007810
CAGE Code : 25403	Manufacturer: Philips Circuit Assemblies	Item Name : Transistor
FSC : 5961 Semiconductor Devices and Associated Hardware

Thank you for choosing to rely on Nascent Aviation for all your operational needs. You have reached our NSN RFQ Page where you can request quotes for our most in-demand NSN 5961-01-300-7810 parts and components with Transistor manufactured by MFG Philips Circuit Assemblies. Some of the items we carry include part number BUW12, and various others, those of which have been thoroughly assessed for quality and reliability. At Nascent Aviation, we set ourselves apart from other distributors in our steadfast commitment to providing guidance at every stage of the procurement process, offering rapid lead times, cost savings, and exceptional customer service

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Nascent Aviation is commended for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the authenticity of our products. The NSN 5961-01-300-7810 products BUW12 that we feature by Philips Circuit Assemblies are paired alongside their corresponding CAGE Code 25403 and FSC 5961 Semiconductor Devices and Associated Hardware More than that, the NSN items we carry are subject to a series of rigorous quality assurance measures, tests, verifications, and assessments, as applicable. If you find a product that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. Alternatively, you can call or email us directly; we are available 24/7x365!

NSN Information for Part Number BUW12 with NSN 5961-01-300-7810, 5961013007810

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5961-01-300-7810 Item Description: Transistor	5961	013007810	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
Buw12	5	9	3

Characteristics Data of NSN 5961-01-300-7810, 5961013007810

MRC	Criteria	Characteristic
ABBH	INCLOSURE MATERIAL	PLASTIC OR CERAMIC
ABJT	TERMINAL LENGTH	13.6 MILLIMETERS MINIMUM
ABMK	OVERALL WIDTH	15.2 MILLIMETERS MAXIMUM
AXGY	MOUNTING METHOD	TERMINAL
CTMZ	III SEMICONDUCTOR MATERIAL	SILICON
CTQX	CURRENT RATING PER CHARACTERISTIC	8.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM
CTSG	MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	150.0 DEG CELSIUS JUNCTION
TTQY	TERMINAL TYPE AND QUANTITY	3 PRINTED CIRCUIT
ABHP	OVERALL LENGTH	21.0 MILLIMETERS MAXIMUM
ABKW	OVERALL HEIGHT	4.6 MILLIMETERS MAXIMUM
ALAS	INTERNAL CONFIGURATION	JUNCTION CONTACT
CTMZ	SEMICONDUCTOR MATERIAL	SILICON
CTQN	VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	450.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN
CTRD	POWER RATING PER CHARACTERISTIC	125.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET
FEAT	SPECIAL FEATURES	JUNCTION PATTERN ARRANGEMENT: NPN