Mfg Part Number: 0P830WSL | NSN : 5961-01-444-8076 | NIIN : 014448076 |
CAGE Code : 32694 | Manufacturer: Optek Technology Inc | Item Name : Semiconductor Device Photo |
FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for choosing to rely on Nascent Aviation for all your operational needs. You have reached our NSN RFQ Page where you can request quotes for our most in-demand NSN 5961-01-444-8076 parts and components with Semiconductor Device Photo manufactured by MFG Optek Technology Inc. Some of the items we carry include part number 0P830WSL, and various others, those of which have been thoroughly assessed for quality and reliability. At Nascent Aviation, we set ourselves apart from other distributors in our steadfast commitment to providing guidance at every stage of the procurement process, offering rapid lead times, cost savings, and exceptional customer service
Nascent Aviation is commended for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the authenticity of our products. The NSN 5961-01-444-8076 products 0P830WSL that we feature by Optek Technology Inc are paired alongside their corresponding CAGE Code 32694 and FSC 5961 Semiconductor Devices and Associated Hardware More than that, the NSN items we carry are subject to a series of rigorous quality assurance measures, tests, verifications, and assessments, as applicable. If you find a product that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. Alternatively, you can call or email us directly; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-444-8076 Item Description: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 014448076 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
0P830WSL | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.187 INCHES MINIMUM AND 0.202 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR" |
ABHP | OVERALL LENGTH | 0.187 INCHES MINIMUM AND 0.202 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR" |
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