NSN Part 323BN With NSN 5962-01-039-3445 by Telcom Semiconductor Inc - RFQ Form

Mfg Part Number: 323BN	NSN : 5962-01-039-3445	NIIN : 010393445
CAGE Code : 15818	Manufacturer: Telcom Semiconductor Inc	Item Name : Microcircuit Digital
FSC : 5962 Microcircuits Electronic

Thank you for choosing to rely on Nascent Aviation for all your operational needs. You have reached our NSN RFQ Page where you can request quotes for our most in-demand NSN 5962-01-039-3445 parts and components with Microcircuit Digital manufactured by MFG Telcom Semiconductor Inc. Some of the items we carry include part number 323BN, and various others, those of which have been thoroughly assessed for quality and reliability. At Nascent Aviation, we set ourselves apart from other distributors in our steadfast commitment to providing guidance at every stage of the procurement process, offering rapid lead times, cost savings, and exceptional customer service

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Nascent Aviation is commended for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the authenticity of our products. The NSN 5962-01-039-3445 products 323BN that we feature by Telcom Semiconductor Inc are paired alongside their corresponding CAGE Code 15818 and FSC 5962 Microcircuits Electronic More than that, the NSN items we carry are subject to a series of rigorous quality assurance measures, tests, verifications, and assessments, as applicable. If you find a product that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. Alternatively, you can call or email us directly; we are available 24/7x365!

NSN Information for Part Number 323BN with NSN 5962-01-039-3445, 5962010393445

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-039-3445 Item Description: Microcircuit Digital	5962	010393445	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	U
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
323bn	5	1	C			A

Characteristics Data of NSN 5962-01-039-3445, 5962010393445

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.246 INCHES MINIMUM AND 0.271 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.180 INCHES MAXIMUM"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND ADJUSTABLE AND EXPANDABLE AND EXTERNALLY COMPENSATED AND MONOLITHIC AND POSITIVE OUTPUTS AND WIRE-OR OUTPUTS AND W/OPEN COLLECTOR"
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	DIODE-TRANSISTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	10 INPUT"
CSSL	DESIGN FUNCTION AND QUANTITY	4 GATE, NAND"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	13.0 VOLTS MAXIMUM POWER SOURCE"
TTQY	TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT"
ADAQ	BODY LENGTH	0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.246 INCHES MINIMUM AND 0.271 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.180 INCHES MAXIMUM"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND ADJUSTABLE AND EXPANDABLE AND EXTERNALLY COMPENSATED AND MONOLITHIC AND POSITIVE OUTPUTS AND WIRE-OR OUTPUTS AND W/OPEN COLLECTOR"
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	DIODE-TRANSISTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	10 INPUT"
CSSL	DESIGN FUNCTION AND QUANTITY	4 GATE, NAND"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	13.0 VOLTS MAXIMUM POWER SOURCE"
TTQY	TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT"